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PRODUCTION OF @(3754/24)METH)ACRYLATE COMPOUND OF EPOXY RESIN, AND PHOTOSOLDER RESIST RESIN COMPOSITION CONTAINING SAME
PRODUCTION OF @(3754/24)METH)ACRYLATE COMPOUND OF EPOXY RESIN, AND PHOTOSOLDER RESIST RESIN COMPOSITION CONTAINING SAME
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机译:环氧树脂@(3754/24)甲基)丙烯酸酯化合物的生产和含有相同成分的光敏抗蚀剂树脂组成
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摘要
PURPOSE: To produce a new compd. which gives a photocured resin film excellent in adhesiveness, heat resistance, and moisture resistance and is suitable for a photosolder resist. ;CONSTITUTION: The compd. is produced by reacting (meth)acrylic acid with an epoxy resin prepd. by using. as its precursor. a polyhydroxynaphthalene compd. which has a wt.-average mol.wt. of 300-2,000 and is obtd. by condensing a naphthol with an aldehyde.;COPYRIGHT: (C)1994,JPO&Japio
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