METHOD FOR IMPROVING ADHESION OF ELECTROLESS PLATED FILM TO RESINOUS ARTICLE

摘要

PURPOSE: To enable plating a metallic covering layer with tight adhesion by bringing a surface of a resious substrate having a specific composition into contact with an alkali metal hydroxide soln. of a specific concn. and then with concentrated nitric acid and thereafter executing electroless metal plating. ;CONSTITUTION: A metallic layer (copper, nickel) is plated on the surface of the resinous substrate containing an aromatic polycarbonate (bisphenol A polycarbonate, etc.), as majority (about 65 to 95 wt.%) and at least one kind of addition copolymer (ABS resin, etc.), containing a structure unit induced from an olefinic nitrile (acrylonitrile, etc.), and a conjugated diene (butadiene, etc.), as minority. At this time, at least a part of the surface of the resinous substrate is brought into contact with the alkali metal hydroxide soln. (potassium hydroxide, etc.), of about ≥30 wt.% concn. and then with concentrated nitric acid (about 30 to 70 wt.%) and thereafter an electroless metallic layer is plated thereon. Thereby, the substrate can be covered with the metallic layer with tight adhesion.;COPYRIGHT: (C)1993,JPO