Hybrid circuit with surface mounted devices - formed from a thin film ceramic substrate and a laminated or adhesive bonded film substrate

摘要

The solid component, as a hybrid circuit with conductors and resistance layers, is a combination of a thick film ceramic substrate (1) and a film substrate (2). The two substrates overlap at least partially with contact between them. The two substrates (1,2) are in contact with each other through lamination or adhesive bonding. The film substrate (2) has at least one aperture (3) as a passage for the component on the ceramic substrate (1). At least one film substrate has a number of conductor planes for the electrical connection between the conductors of these planes by electroplating through holes in the film substrate. USE/ADVANTAGE - The component is a hybrid circuit with surface mounted devices. The structure and assembly is simple.