首页> 外国专利> Electronic surface mount device - has electronic element with exposed flat surface in its upper region for drawing up device with suction nozzle

Electronic surface mount device - has electronic element with exposed flat surface in its upper region for drawing up device with suction nozzle

机译:电子表面安装装置-在其上部区域具有带裸露平坦表面的电子元件,用于起草带有吸嘴的装置

摘要

The surface mount device (SMD) includes a substrate (1). An electronic element (2) is mounted on the substrate. Several electrodes (4,5) are arranged on a surface of the substrate for the electrical connection of the electronic element. The electronic element has an exposed flat surface in its upper region (2a) which is used for sucking up the device with a suction nozzle (3). The electronic element is mounted in the middle of the substrate. ADVANTAGE - Can be miniaturised without requiring casing or moulding.
机译:表面安装装置(SMD)包括基板(1)。电子元件(2)安装在基板上。多个电极(4,5)布置在基板的表面上,用于电子元件的电连接。电子元件在其上部区域(2a)中具有暴露的平坦表面,该平坦表面用于通过吸嘴(3)吸起装置。电子元件安装在基板的中间。优点-无需外壳或模制即可小型化。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号