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Silicon sample holder for molecular beam epitaxy on pre- fabricated integrated circuits

机译:预制集成电路上用于分子束外延的硅样品架

摘要

The sample holder of the invention is formed of the same semiconductor crystal as the integrated circuit on which the molecular beam expitaxial process is to be performed. In the preferred embodiment, the sample holder comprises three stacked micro-machined silicon wafers: a silicon base wafer having a square micro-machined center opening corresponding in size and shape to the active area of a CCD imager chip, a silicon center wafer micro-machined as an annulus having radially inwardly pointing fingers whose ends abut the edges of and center the CCD imager chip within the annulus, and a silicon top wafer micro-machined as an annulus having cantilevered membranes which extend over the top of the CCD imager chip. The micro-machined silicon wafers are stacked in the order given above with the CCD imager chip centered in the center wafer and sandwiched between the base and top wafers. The thickness of the center wafer is about 20% less than the thickness of the CCD imager chip. Preferably, four titanium wires, each grasping the edges of the top and base wafers, compress all three wafers together, flexing the cantilever fingers of the top wafer to accommodate the thickness of the CCD imager chip, acting as a spring holding the CCD imager chip in place.
机译:本发明的样品保持器由与要在其上进行分子束外延加工的集成电路相同的半导体晶体形成。在优选实施例中,样品架包括三个堆叠的微加工硅晶片:硅方形晶片,其方形正方形的微加工中心开口的尺寸和形状与CCD成像器芯片的有效区域相对应;硅中央晶片被加工成具有径向向内指向的手指的环,其末端邻接CCD成像器芯片的边缘并将其定位在环中,并且将硅顶部晶圆微加工成具有环的悬臂膜,该悬臂膜延伸到CCD成像器芯片的顶部。以上面给定的顺序堆叠微加工的硅晶片,而CCD成像器芯片位于中心晶片中,并夹在基础晶片和顶部晶片之间。中心晶片的厚度比CCD成像器芯片的厚度小20%。优选地,四根钛丝分别抓住顶部和底部晶片的边缘,将所有三个晶片压缩在一起,使顶部晶片的悬臂指弯曲以适应CCD成像器芯片的厚度,作为弹簧固定CCD成像器芯片。到位。

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