Tip/chip condition electronic parts lamp foot manner and its device

摘要

PURPOSE:To enable chip-type electronic components to be transported forcedly by flow of gas while preventing the chip-type electronic components from being damaged by shock, by once stopping the electronic component directly before a receiving recess and then letting the component fall down under its own weight therefrom into the receiving recess. CONSTITUTION:Chip-type electronic components (a) supplied from a container 1 through a chute 21 are stopped once at an escapement 22 and they are dropped one by one at every drive by a solenoid 24. At this moment, a valve 13 is closed while a valve 12 is opened so that air is circulated from the chute 21 through a suction path 26 to a pneumatic unit 11, whereby the component (a) is transported forcedly through the chute 21 and stopped at an aperture 25a. The valve 12 is then closed and the component (a) is let fall down by its own weight and received by a receiving recess 61 of a template 6. The valve 13 is opened and air is caused to flow through the path from the chute 21 to the pneumatic unit 11, whereby the component (a) is blew down. The component (a) thus laid is transported to and arranged on a wiring board.