首页> 外国专利> FORMING METHOD FOR DONOR-DOPED PEROVSKITE MATERIAL FOR THIN FILM DIELECTRIC MATERIAL AND STRUCTURE CONTAINING SUCH MATERIAL

FORMING METHOD FOR DONOR-DOPED PEROVSKITE MATERIAL FOR THIN FILM DIELECTRIC MATERIAL AND STRUCTURE CONTAINING SUCH MATERIAL

机译:薄膜介电材料的掺掺杂掺杂钙钛矿材料的形成方法及包含这种材料的结构

摘要

PURPOSE: To maximize the permittivity of a thin-film perovskite material by performing the doping of the perovskite material, without keeping a board at high temperature. CONSTITUTION: The permittivity of a perovskite material becomes higher under its Curie temperature accordingly, as its crystal grain size becomes smaller. A donar dopant makes the crystal grain size of the perovskite material smaller. Accordingly, as a result of performing the doping of an intrinsic perovskite material with donar dopants and then forming a donor-doped perovskite material layer, having average grain size smaller than its intrinsic critical crystal grain size, the permittivity of this layer is mage higher than that of the intrinsic material which has an average crystal grain size similar to the average crystal grain size of this layer. It is preferable that doping with acceptor dopants be performed, in addition to making the resistance of this material higher and/or to make its dielectric tangent smaller. The construction on the board surface comprizes a conductive layer and the layer of this donor-doped perovskite material which is in touch with this.
机译:目的:通过掺杂钙钛矿材料来最大化薄膜钙钛矿材料的介电常数,而无需将板保持在高温下。组成:钙钛矿材料在其居里温度下的介电常数随着其晶粒尺寸的变小而变高。施主掺杂剂使钙钛矿材料的晶粒尺寸更小。因此,通过用施主掺杂剂掺杂本征钙钛矿材料,然后形成平均粒径小于其本征临界晶体粒径的施主掺杂钙钛矿材料层的结果,该层的介电常数大于具有与该层的平均晶粒尺寸相似的平均晶粒尺寸的本征材料的晶粒尺寸。除了使该材料的电阻更高和/或使其介电切线较小之外,优选地用受主掺杂剂进行掺杂。板表面上的构造包括导电层和与该施主掺杂的钙钛矿材料接触的层。

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