HEAT-RESISTANT, ELECTRICALLY-CONDUCTIVE RESIN COMPOSITION AND HEAT-RESISTANT IC TRAY USING THE SAME

摘要

PURPOSE:To obtain a composition to be made into a tray having excellent heat resistance, permanence and dimensional accuracy by blending a base composed of an aromatic polysulfone resin, a polycarbonate resin, etc., with electrically conductive carbon black, mica and a carbodiimide compound. CONSTITUTION:A base composed of 40-90wt.% of an aromatic polysulfone resin, 10-60wt.% of a polycarbonate resin and 0-20wt.% of an aromatic polyester resin is blended with 3-20wt.% of electrically conductive carbon black, 2-20wt.% of mica powder and 0.1-5wt.% of a carbodiimide compound. The composition is injection molded to produce an IC tray having 100 to 1012OMEGA surface resistivity and 150 deg.C heat resistance. The aromatic polycarbonate resin preferably contains a copolymer of a homopolymer derived from 2,2-bis-(4-hydroxyphenyl)propane and a polymer derived from 2,2-bis-(4-hydroxyphenyl)trimethylcyc lohexane. A poly(hexamethylenecarbodiimide) of a polymer type bonded by a carbodiimide group is used as the carbodiimide compound.