CHIP TYPE SURGE ABSORBER USING MICRO-GAP METHOD

摘要

PURPOSE: To provide a chip type surge absorber using a micro-gap method wherein an electronic-apparatus protecting function is obtained by its absorption of an instantaneous surge voltage, and in addition to this, the adjustment of its electrostatic capacitance is made easy when it is manufactured, and by its chip type configuration, it can be mounted on the surface of a printed circuit board, etc., and further, its discharge starting voltage is not varied by the condition of the atmosphere. ;CONSTITUTION: A pair of insulation boards 13, 14 is superimposed in parallel on each other while a predetermined micro-gap 12 is interposed between the boards 13, 14 by the sandwichings of insulation spacers 11, 11 between them. In both the end parts of the boards 13, 14, a pair of terminal electrodes 16, 17 is provided. On the opposite surface of the one board 13 to the board 14, a conductive thin film 18 whose one end is connected electrically with the terminal electrode 16 is formed, and on the opposite surface of the other board 14 to the board 13, a conductive thin film 19 whose one end is connected electrically with the terminal electrode 17 is formed. A sealed space may be formed by the used of the boards 13, 14 and the insulation spacers 11, 11, and an inert gas may be filled into this sealed space.;COPYRIGHT: (C)1995,JPO