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NON-CYAN COPPER-ZINC ELECTROPLATING BATH, SURFACE TREATMENT OF COPPER FOIL FOR PRINTED CIRCUIT BOARD USING THE BATH, AND THE COPPER FOIL FOR PRINTED CIRCUIT BOARD
NON-CYAN COPPER-ZINC ELECTROPLATING BATH, SURFACE TREATMENT OF COPPER FOIL FOR PRINTED CIRCUIT BOARD USING THE BATH, AND THE COPPER FOIL FOR PRINTED CIRCUIT BOARD
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机译:非青铜镀锌浴,使用浴液处理印刷电路板用铜箔的表面处理以及印刷电路板用铜箔的表面处理
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摘要
PURPOSE: To produce the copper foil for a printed circuit board excellent in migration resistance by forming a C-contg. Cu-Zn coating layer with the specified composition on the surface of the copper foil and further forming a chromating layer and a silane coupling layer thereon. ;CONSTITUTION: A copper foil is dipped in a non-cyan Cu-Zn plating bath of an aq. soln. contg. 5-60 gel copper salt such as copper sulfate, 2-30g/l zinc salt such as zinc sulfate, 20-120g/l oxycarboxylic acid or the salt such as Na glucoheptonate, 20-120g/l aliphatic dicarboxylic acid or the salt such as K oxalate and 1-20g/l. thiocyanic acid or its salt such as K thiocyanate and cathodized to form a Cu-Zn coating layer contg. 40-90 atomic % Cu, 5-50% Zn and 0.1-20% C. A chromating layer and a silane coupling layer are further formed thereon to produce the copper foil for a printed circuit board excellent in migration resistance.;COPYRIGHT: (C)1995,JPO
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