首页> 外国专利> MEASURING METHOD FOR CONCENTRATION OF ADDITIVE IN ELECTROLESS COPPER PLATING LIQUID

MEASURING METHOD FOR CONCENTRATION OF ADDITIVE IN ELECTROLESS COPPER PLATING LIQUID

机译:化学镀铜液中添加剂浓度的测定方法

摘要

PURPOSE: To obtain the concentration of the additive in plating liquid by measuring the electrochemical characteristic value on an electrode by dipping the metallic electrode after a material for removing formaldehyde in electroless copper plating liquid is added into the electroless copper plating liquid. ;CONSTITUTION: Formaldehyde in electroless copper plating liquid is removed. The electrochemical characteristic value on a metallic electrode is measured under the state wherein the plating reaction of the electroless copper plating liquid does not occur and the effect of the formaldehyde itself is removed. Thus, the behavior of additive is adequately obtained. As the material for removing the formaldehyde in the electroless copper plating liquid, one or more kinds of sodium sulfite, sodium hydrogensulfite, hydrogen peroxide and iodine can be used. As the electrode, gold, platinum and palladium are suitable. As the configurations, the substances in the shapes of a plate (box), and a disk (rotary electrode) are suitable. It is preferable that the electrochemical characteristic value as the index of the additive concentration is measured by a potential- current curve method and the like.;COPYRIGHT: (C)1995,JPO
机译:目的:在将用于去除化学镀铜液中甲醛的材料添加到化学镀铜液中之后,通过浸入金属电极以测量电极上的电化学特性值,从而获得镀液中添加剂的浓度。 ;组成:去除化学镀铜液中的甲醛。在不发生化学镀铜液的镀覆反应且除去甲醛本身的影响的状态下,测定金属电极上的电化学特性值。因此,可以充分获得添加剂的性能。作为除去化学镀铜液中的甲醛的材料,可以使用亚硫酸钠,亚硫酸氢钠,过氧化氢和碘中的一种或多种。作为电极,金,铂和钯是合适的。作为构造,板状(盒状)和盘状(旋转电极状)的物质是合适的。电化学特性值作为添加剂浓度的指标优选通过电位-电流曲线法等进行测定。COPYRIGHT:(C)1995,JPO

著录项

  • 公开/公告号JPH0798296A

    专利类型

  • 公开/公告日1995-04-11

    原文格式PDF

  • 申请/专利权人 HITACHI CHEM CO LTD;

    申请/专利号JP19930243457

  • 申请日1993-09-30

  • 分类号G01N27/416;C23C18/31;G01N27/48;

  • 国家 JP

  • 入库时间 2022-08-22 04:21:01

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