首页> 外国专利> Reduction or elimination of film defects due to hydrogen evolution during cathodic electrodeposition

Reduction or elimination of film defects due to hydrogen evolution during cathodic electrodeposition

机译:减少或消除由于在阴极电沉积过程中放出氢气而导致的薄膜缺陷

摘要

This invention is directed to a method for eliminating or reducing pinhole defects in cataphoretically deposited films without interfering with the electrolysis of water needed for electrodeposition. The method comprises decreasing the evolution of hydrogen gas at the cathode by adding, to the electrodepositable composition, a compound which is reduced by the hydrogen produced at the cathode during the electrodeposition. The hydrogen reacts with this non-gaseous compound rather than becoming hydrogen gas and forming bubbles which lead to pinhole defects.
机译:本发明涉及一种消除或减少电泳沉积膜中的针孔缺陷而不干扰电沉积所需水电解的方法。该方法包括通过向可电沉积的组合物中加入在电沉积期间在阴极处产生的氢所还原的化合物来减少在阴极处氢气的逸出。氢与这种非气态化合物反应,而不是变成氢气并形成气泡,从而导致针孔缺陷。

著录项

  • 公开/公告号EP0476821B1

    专利类型

  • 公开/公告日1995-05-03

    原文格式PDF

  • 申请/专利权人 ROHM AND HAAS COMPANY;

    申请/专利号EP19910307198

  • 发明设计人 WINKLE MARK ROBERT;

    申请日1991-08-06

  • 分类号C09D5/44;

  • 国家 EP

  • 入库时间 2022-08-22 04:13:44

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