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ELECTRONICS SYSTEM WITH DIRECT WRITE ENGINEERING CHANGE CAPABILITY

机译:具有直接写工程变更能力的电子系统

摘要

system and method for providing electronic technical changes to a substrate without requiring the addition of son not integrated, and relatively large areas for this plot. the location of the device is surrounded by a series of annular configuration of technical change (43, 44, 45).a number of configurations of technical change leads to changes of interconnections between the locations of the devices.the mu00e9tallisations entrance (60) extending towards the interior until the location of the device from the configuration change, a series of interconnections between layers (57, 63, 69) that make the connections adjacent to the annular surface configurations.technical changes are made using direct metal deposition surface to establish appropriate links between the interconnections between layers and the annular configuration.the initial connections with the plot of chips (28, 29), and the connections with the annular configuration (43) can be isolated by laser deletion properly in case of need.
机译:用于为基板提供电子技术更改而无需添加未集成子的系统和方法,以及该图的相对较大区域。设备的位置被一系列环形的技术更改配置所围绕(43、44、45)。许多技术更改的配置导致设备位置之间的互连更改.m入口(60 )朝内部延伸直到器件的位置从构形改变开始,各层(57、63、69)之间的一系列互连使连接与环形表面构形相邻。使用直接金属沉积表面进行技术更改在层和环形结构之间的互连之间建立适当的链接。如果需要,可以通过激光删除适当地隔离与芯片图(28、29)的初始连接以及与环形结构(43)的连接。

著录项

  • 公开/公告号EP0530185B1

    专利类型

  • 公开/公告日1995-01-25

    原文格式PDF

  • 申请/专利权人 IBM;

    申请/专利号EP19900915885

  • 申请日1990-10-10

  • 分类号H01L23/538;H01L23/525;H01L21/48;

  • 国家 EP

  • 入库时间 2022-08-22 04:13:37

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