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PROCESS OF MANUFACTURE OF PLANAR P-N JUNCTIONS ON INDIUM ANTIMONIDE

机译:锑化铟上平面P-N结的制备过程

摘要

FIELD: microelectronics. SUBSTANCE: in process of manufacture of planar p-n junctions based on indium antimonide first surface of starting plate of indium antimonide is prepared, masking silicon film is deposited by synthesis from gaseous phase, windows for local injection of impurity atoms are open in it. Then diffusion is conducted, masking film is removed and surface layer is etched off of plate. EFFECT: facilitated manufacture. 1 tbl
机译:领域:微电子学。物质:在以锑化铟为基础的平面p-n结的制造过程中,准备了锑化铟起始板的第一表面,通过气相合成法沉积了掩膜硅膜,并在其中打开了用于局部注入杂质原子的窗口。然后进行扩散,去除掩膜并从板上蚀刻掉表面层。效果:便于制造。 1汤匙

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