Process and solder paste for soldering large-area boards made of aluminum or aluminum alloys and application of the process

摘要

PCT No. PCT/EP94/02581 Sec. 371 Date Jun. 17, 1996 Sec. 102(e) Date Jun. 17, 1996 PCT Filed Aug. 4, 1994 PCT Pub. No. WO95/13902 PCT Pub. Date May 26, 1995In a process for soldering on large-area plates of aluminum or aluminum alloys on to a workpiece comprising an iron-base alloy, use is made of a soldering paste comprising a flux with about 50% potassium fluoride and about 50% aluminum fluoride, a solder powder with about 80 to 90% aluminum and 20 to 10% silicon and a binder on a polymethacrylate base. In addition the respective proportions of the flux are between 40 and 60% by weight, the solder powder between 60 and 40% by weight and the binder between 0.2 and 2% by weight.