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Process for forming twin well CMOS integrated circuits

机译:形成双阱CMOS集成电路的工艺

摘要

A process of forming complementary insulated gate field effect transistors includes forming first and second well regions of first and second conductivity types in a planar semiconductor layer so that the well regions have an impurity retrograde impurity distribution profile. An insulator layer is then selectively formed with a first relatively thick insulator portion and thin gate portions. The first and second gates are formed on the relatively thin portions of the insulator layer. Insulator spacers are formed so as to extend laterally from the gates and from the relatively thick insulator portion. First impurities are introduced using the first gate and spacers as a mask to form first source and drain regions. Second impurities of an opposite conductivity type are introduced using the second gate and spacers as a mask to form source and drain regions of a complementary device.
机译:形成互补绝缘栅场效应晶体管的工艺包括在平面半导体层中形成具有第一和第二导电类型的第一和第二阱区,使得该阱区具有杂质逆行杂质分布轮廓。然后,绝缘体层选择性地形成有第一相对较厚的绝缘体部分和较薄的栅极部分。第一和第二栅极形成在绝缘体层的相对薄的部分上。形成绝缘体间隔件,以便从栅极和相对较厚的绝缘体部分横向延伸。使用第一栅极和间隔物作为掩模引入第一杂质,以形成第一源极和漏极区域。使用第二栅极和间隔物作为掩模引入相反导电类型的第二杂质,以形成互补器件的源极和漏极区域。

著录项

  • 公开/公告号US5429958A

    专利类型

  • 公开/公告日1995-07-04

    原文格式PDF

  • 申请/专利权人 HARRIS CORPORATION;

    申请/专利号US19930080744

  • 发明设计人 DYER A. MATLOCK;

    申请日1993-06-22

  • 分类号H01L21/8238;

  • 国家 US

  • 入库时间 2022-08-22 04:04:45

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