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CHIP RESISTOR FOR SURFACE MOUNTING AND ITS SURFACE-MOUNTING METHOD

机译:用于表面贴装的芯片电阻及其表面贴装方法

摘要

PURPOSE: To radiate heat generated in a resistor from the entire surface of a resistor support and to suppress the temperature increase of parts by burying the resistor into the resistor support consisting of an insulator and providing the electrode of the resistor at both side parts of the resistor support. CONSTITUTION: A resistor 2 consisting of copper or ruthenium oxide is covered so that it is sandwiched from upper and lower portions by a resistor support 1 consisting of an insulating material such as ceramic and at the same time an electrode 3 of the resistor 2 intrudes the upper resistor support 1 and is arranged at both sides, thus constituting a chip resistor. This sort of chip resistor is manufactured by printing and baking a resistor paste on the lower resistor support 1 consisting of the insulating material for forming a resistor 2 and then laminating an insulating material which becomes the upper resistor support 1 and at the same time arranging the electrode 3, thus suppressing the temperature increase of parts and at the same time improving the reliability of the parts and miniaturizing the parts and improving the yield.
机译:目的:通过将电阻器埋入由绝缘体组成的电阻器支架中,并在电阻器的两侧部分提供电阻器的电极,从电阻器支架的整个表面散发电阻器中产生的热量,并抑制零件的温度升高。电阻器支持。组成:由铜或氧化钌组成的电阻器2覆盖着,使其上下由电阻支架1夹在中间,该电阻器支架1由绝缘材料(例如陶瓷)组成,电阻器2的电极3插入其中。上电阻器支架1并布置在两侧,从而构成片式电阻器。这种片状电阻器的制造方法是,在下部电阻器支架1上印刷并烘烤电阻器浆料,该下部电阻器支架由用于形成电阻器2的绝缘材料组成,然后层压成为上部电阻器支架1的绝缘材料,并同时布置电极3,从而抑制了部件的温度升高,同时提高了部件的可靠性,并使部件小型化并提高了成品率。

著录项

  • 公开/公告号JPH08181001A

    专利类型

  • 公开/公告日1996-07-12

    原文格式PDF

  • 申请/专利权人 MITSUBISHI ELECTRIC CORP;

    申请/专利号JP19940325374

  • 发明设计人 MARUYAMA KATSUAKI;UCHIDA NORIYUKI;

    申请日1994-12-27

  • 分类号H01C1/14;H01C1/08;H01C7/00;H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-22 04:03:04

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