WAFER SHEET AND SEMICONDUCTOR MANUFACTURING EQUIPMENT USING THE SAME

摘要

PURPOSE: To surely prevent the sticking of foreign matter due to the transfer of a wafer sheet to the back of a pellet. ;CONSTITUTION: In a wafer sheet 3 which retains pellets 2 subjected to dicing, a circular pickup hole 3a is formed in the central part of each pellet 2. The pellet 2 is pushed up from the back of the pellet 2 with a pushing-up needle 5a which pushes up the pellet 2, and peeled from the wafer sheet 3. In the wafer sheet 3, the pickup holes 3a are arranged at the positions with which the pushing-up needle 5a comes into contact. Since the pushing-up needle 5a directly comes into contact with the back of the pellet 2, the sticking of a broken wafer sheet to the back of the pellet 2 can be prevented. The tip part of the pushing-up needle 5a is made round or flat, in order to prevent a flaw of the pellet 2.;COPYRIGHT: (C)1996,JPO