DIAMINE COMPOUND, HEAT-RESISTANT POLYMER PRECURSOR, HEAT-RESISTANT POLYMER PRECURSOR COMPOSITION, AND HEAT RESISTANT POLYMER

摘要

PURPOSE: To obtain a heat-resistant polymer precursor excellent in the adhesion to a sealing resin and suited for use as a protective film for a semiconductive element, etc., by polymerizing a specific diamine compound mixture with a 6C or higher acid dianhydride. ;CONSTITUTION: A diamine compound mixture containing at least 5mol% diamine compound represented by formula I, II, or III (wherein A is COO, NHCOO, or NHCONH; R⁶ is a 4C or lower alkyl or phenyl; and (k) is 2-4) is polymerized with a 6C or higher acid dianhydride (e.g. 3,3',4,4'-biphenyltetracarboxylic dianhydride) to produce a heat-resistant polymer precursor. To this precursor are added necessary additives such as an amine compound having a carbon- carbon double bond, a sensitizer, a sensitizer aid, and a solvent. This composition is used for forming a film for covering a semiconductor chip, etc.;COPYRIGHT: (C)1996,JPO