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LEAD FRAME, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE DEVICE
LEAD FRAME, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE DEVICE
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机译:引线框架,半导体集成电路装置,半导体集成电路装置制造和半导体集成电路装置制造装置
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摘要
PURPOSE: To realize high mounting while realizing compactness by enlarging a lead pitch interval at a solder land part by providing a lead pattern which extends radially around a die pad arranged in a central part of a conductive disc member. ;CONSTITUTION: A circular lead frame wherein a lead is extended radially from a die pad at a central part is completed by punching a lead frame element material 9 formed to prepare one IC package to one lead frame by a press. Then, a semiconductor chip 5 is die-bonded to the lead frame 10. After a gold line 7 is wire-bonded, it is formed by molding by using resin 8. Then, resin burr 11 between leads 6 is removed by a process in a press die, a die bar 12 and an outer circumferential ring 13 are pulled down, lead bending processing is performed for the lead 6 by a punch and a die of a circular die set and a semiconductor integrated circuit is completed.;COPYRIGHT: (C)1996,JPO
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