MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF AND ORIGINAL EDITION FOR TRANSFERRING TO BE USED FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF

摘要

PURPOSE: To eliminate a plating and a photo etching process on a substrate and lessen the number of manufacturing processes by making a lamination of wiring patterns by transferring wiring pattern layers on an original edition for transfer in order onto the substrate. ;CONSTITUTION: Wiring pattern layers 3, 4, 5 which constitute a multilayer printed wiring board 1 have conductive layers 3a, 4a, 5a and insulating resin layers 3b, 4b, 5b formed under the conductive layers respectively. This multilayer printed wiring board 1 has an overprinting structure wherein the wiring pattern layers 3, 4, 5 are transferred in order onto the substrate 2 or a lower wiring pattern layer. At the sections (crossing sections) where the wiring pattern layers cross each other, the insulation between the upper and the lower wiring pattern layers is kept by the insulating resin layers which constitute upper wiring pattern layers. Therefore, the conductive layers 3a, 4a, 5a of the wiring pattern layers 3, 4, 5 are partially exposed at all times and thereby the connection between the wiring pattern layers can be done easily.;COPYRIGHT: (C)1996,JPO