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MOLD SURFACE RELEASE TREATMENT RESIN COMPOSITION, RELEASE TREATMENT OF SURFACE OF MOLD USING THE COMPOSITION, PRODUCTION OF THERMOSETTING RESIN MOLDED PRODUCT USING MOLD RELEASE-TREATED WITH THE COMPOSITION
MOLD SURFACE RELEASE TREATMENT RESIN COMPOSITION, RELEASE TREATMENT OF SURFACE OF MOLD USING THE COMPOSITION, PRODUCTION OF THERMOSETTING RESIN MOLDED PRODUCT USING MOLD RELEASE-TREATED WITH THE COMPOSITION
PURPOSE: To obtain a mold surface release treatment resin compsn. capable of imparting excellently persistent release properties to the surface of a mold. ;CONSTITUTION: A mold surface release treatment resin compsn. capable of imparting release properties to the surface of a mold for hot compression molding comprises (a) an epoxy resin, (b) a curing agent, (c) a curing accelerator, (d) a filler, (e) a release agent, and (f) an antioxidizing agent as the indispensable components. The amt. of the release agent (e) is in the range of 0.3 to 5wt.%.based on the whole compsn., while the amt. of the antioxidizing agent (f) is in the range of 0.3 to 5wt.% based on the whole compsn.;COPYRIGHT: (C)1995,JPO
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