RAIL BOND WIRE BONDING METHOD FOR RAILWAY RAIL AND BONDING DEVICE FOR RAIL BOND WIRE

摘要

PURPOSE: To perfectly bond a terminal to a rail in a short time without using any high temperature by making the terminal of a rail bond wire abut on a solder electrodeposition layer on a surface layer clean part formed on the rail and bonding melted solder in its void. ;CONSTITUTION: A liquid-retaining contact 3 which is formed by evaporating a positive electrode solder 4 layer on the surface on nonwoven fabric and making to retain electrolyte for solder is contacted and fixed to a surface clean part 2 which is formed by removing rust from the surface of a railway rail 1 by a grinder. In this state, when the negative and the positive electrodes of a power supply 5 are connected to a rail 1 and the solder 4 by wires 7A and 6 respectively, an current flows and electrolysis is generated so that a solder electrodeposition layer 8 is formed on the surface of the clean part 2. The bond face 9B of the terminal 9A of a rail bond wire 9 is made to abut on the surface of this layer 8 and a solder foil, etc., are sandwiched in a solder void 10 formed by separating its top part a little, so as to bond together by applying a burner frame. The terminal 9A is thus bonded to the rail 1 firmly, easily in a short time without using any high temperature.;COPYRIGHT: (C)1995,JPO