PURPOSE: To obtain an adhesive-coating-diameter measuring method whose operating efficiency is enhanced by a method wherein a coating-diameter testing mark for a proper coating diameter is formed in advance on a printed-wiring board and the testing mark is compared with an adhesive-coating diameter. ;CONSTITUTION: Ringed testing marks 22, 22A which are not overlapped with a circuit pattern are formed on a printed-wiring board 20. The marks 22, 22A are used to test the coating diameter of small-diameter adhesives 14 and large- diameter adhesives 14A. Then, the printed-wiring board 20 on which the testing marks 22, 22A have been formed is sent to a dispenser. The dispenser feeds an adhesive, only for a prescribed coating time, to one out of the marks 22, 22A or to both of them. Then, it is checked whether or not the coating diameter of the adhesive is within a range of the ring width of the marks 22, 22A.;COPYRIGHT: (C)1995,JPO
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