A wafer heating chuck (10) includes a backplane (11) for mounting the wafer thereon. A rear surface of the backplane includes an outer annular recess (20) with an outer angled wall (22). An outer annular heater is located within the recess and has an outer surface complementarily angled with respect to the wall. An inner annular heater (30) resides inside the outer heater, adjacent therear surface. A clamping member secured to the backplane includes inner (26) and outer (36) retainers which separately clamp the inner and outer heaters, respectively, to the backplane to assure solid to solid contact for optimum heat transfer therebetween. Sensors (52, 54) sense backplane temperature at the inner and outer regions. Coolant is directed through channels (44) in the backplane and through channels in a cooling ring (70) secured to a backplane to influence the temperature of the backplane. A controller (80) connects to the heaters, the sensors and coolant supplies for temperature profiling to achieve temperature uniformity during processing for a wafer (12) mounted to the backplane of the heating chuck.
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