首页> 外国专利> PROCESS FOR SELECTIVELY APPLYING A FINISHING LAYER AND ONE OF TIN OR TIN/LEAD ALLOY TO METAL OR METALLIZED ARTICLES

PROCESS FOR SELECTIVELY APPLYING A FINISHING LAYER AND ONE OF TIN OR TIN/LEAD ALLOY TO METAL OR METALLIZED ARTICLES

机译:有选择地将精加工层和一种或多种锡或锡/铅合金应用于金属或金属化制品的过程

摘要

The aim is selectively to apply a finishing layer (V) of a precious metal or precious metal alloy to selected areas of metal or metallized articles. To that end, the finishing layer (V) is first applied by galvanic metal deposition to areas which are larger than the selected areas. An etch-resistant layer (S) is then applied precisely to the selected areas by electro-dipcoating; this layer is used to enhance the etching selectivity of the process by which the exposed finishing layer is etched away. Tin or tin/lead alloy is then applied to spcific areas of the articles (T) by galvanic metal deposition, the etch-resistant layer (S) serving as the galvanic resist which prevents contamination of the finishing layer (V) with tin or tin/lead alloy. Removal of the etch-resistant layer (S) leaves a finishing layer (V) which precisely covers the selected areas. The finishing material removed during the selectivity enhancement process is then, for example, salvaged from the etching solution by electrolysis.
机译:目的是选择性地将贵金属或贵金属合金的精加工层(V)施加到金属或金属化制品的选定区域。为此,首先通过电镀金属沉积将精加工层(V)施加到大于所选区域的区域。然后通过电浸涂法将耐腐蚀层(S)精确地施加到所选区域;该层用于增强蚀刻掉暴露的饰面层的工艺的蚀刻选择性。然后通过电镀金属将锡或锡/铅合金涂到制品(T)的特定区域,耐腐蚀层(S)用作电镀抗蚀剂,可防止锡或锡污染精加工层(V) /铅合金。去除抗蚀刻层(S)留下精加工层(V),该精加工层(V)精确地覆盖所选区域。然后,例如通过电解从蚀刻溶液中清除在选择性增强过程中去除的整理材料。

著录项

  • 公开/公告号WO9534697A2

    专利类型

  • 公开/公告日1995-12-21

    原文格式PDF

  • 申请/专利权人 SIEMENS S.A.;WILLE JOOST;

    申请/专利号WO1995EP02297

  • 发明设计人 WILLE JOOST;

    申请日1995-06-13

  • 分类号C25D3/30;C23F1/02;C25D3/48;C25D3/56;C25D3/62;

  • 国家 WO

  • 入库时间 2022-08-22 03:49:09

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