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PROCESS FOR PRODUCING SUBSEQUENTLY CONDITIONABLE CONTACT POINTS ON CIRCUIT SUBSTRATES AND CIRCUIT SUBSTRATES WITH SUCH CONTACT POINTS
PROCESS FOR PRODUCING SUBSEQUENTLY CONDITIONABLE CONTACT POINTS ON CIRCUIT SUBSTRATES AND CIRCUIT SUBSTRATES WITH SUCH CONTACT POINTS
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机译:在电路基底上以及在具有这种接触点的电路基底上产生后续可调节的接触点的方法
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摘要
process for the manufacture of contact points can be brought into contact with the two subsequent track driver support circuit separated by a layer of electrically insulating, offers an opportunity to establish a pattern of e.g. the driver easily ad aptable, in the short term, and subsequently, the corresponding requirements.in a window in the floor plans of the conductive so that the parts in the shape of rods connected at the periphery of the opening are provided with openings at or through the electrically insulating layer and the etching in the etching of the underlyingthese parts in the shape of open bar may be placed in contact with the other parts u00e9lectroconductrices track plan can electrically connect the conductive leads electrically conductive by mechanical bending.
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