首页> 外国专利> PROCESS FOR PRODUCING SUBSEQUENTLY CONDITIONABLE CONTACT POINTS ON CIRCUIT SUBSTRATES AND CIRCUIT SUBSTRATES WITH SUCH CONTACT POINTS

PROCESS FOR PRODUCING SUBSEQUENTLY CONDITIONABLE CONTACT POINTS ON CIRCUIT SUBSTRATES AND CIRCUIT SUBSTRATES WITH SUCH CONTACT POINTS

机译:在电路基底上以及在具有这种接触点的电路基底上产生后续可调节的接触点的方法

摘要

process for the manufacture of contact points can be brought into contact with the two subsequent track driver support circuit separated by a layer of electrically insulating, offers an opportunity to establish a pattern of e.g. the driver easily ad aptable, in the short term, and subsequently, the corresponding requirements.in a window in the floor plans of the conductive so that the parts in the shape of rods connected at the periphery of the opening are provided with openings at or through the electrically insulating layer and the etching in the etching of the underlyingthese parts in the shape of open bar may be placed in contact with the other parts u00e9lectroconductrices track plan can electrically connect the conductive leads electrically conductive by mechanical bending.
机译:用于制造接触点的方法可以与由电绝缘层隔开的两个随后的轨道驱动器支撑电路接触,从而提供了建立例如图1的图案的机会。在短期内以及随后对驱动器的相应要求方面,驱动器很容易适应。在导电层的平面图中的一个窗口中,以便在开口周围连接的杆状零件在或处具有开口通过电绝缘层的蚀刻和在蚀刻过程中,可以将这些下部形状的敞开杆放置成与其他部分接触,从而可以通过机械弯曲使导电引线导电。

著录项

  • 公开/公告号EP0600052B1

    专利类型

  • 公开/公告日1996-04-17

    原文格式PDF

  • 申请/专利权人 DYCONEX PATENTE AG;

    申请/专利号EP19930909756

  • 发明设计人 MARTINELLI MARCO;SCHMIDT WALTER;

    申请日1993-06-10

  • 分类号H05K3/40;

  • 国家 EP

  • 入库时间 2022-08-22 03:47:37

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号