Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant

摘要

A high dielectric (K' 5), comparatively low thermal coefficient (absolute value of TCK' ≦ 200 ppm/°C) polymeric composite is presented . The composite comprises a polymeric matrix; particulate ceramic filler material, said filler material comprising a mixture of at least one first ceramic material having a K' 30 and a TCK' 0 ppm/°C; and at least one second ceramic material having a K' 30 and a TCK' - 300 ppm/°C. The mixture of ceramic fillers is proportioned in a ratio effective to provide the composite material with a K' of ≧ 5 and an absolute value TCK' of 200 ppm/°C.