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Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant
Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant
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机译:具有高介电常数和低介电常数热系数的陶瓷填充复合聚合物电基底材料
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摘要
A high dielectric (K'≧5), comparatively low thermal coefficient (absolute value of TCK'≦200 ppm/°C.) polymeric composite matrix is presented comprising commonly available and low cost fillers such as titania, alumina and magnesium oxide.
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