Method for cleaning metal contaminants on a wafer substrate while maintaining flatness of the wafer

摘要

The present invention relates to a process for removing metal contaminants in a wafer substrate while maintaining the flatness of the wafer by contacting the wafer substrate with an aqueous, metal ion-free substrate, an amphoteric surfactant and optionally a cleaning agent composition comprising a metal complexing agent and a propylene glycol ether organic solvent And to a method of cleaning.