The fatigue resistance of lead-tin eutectic solder is increased by doping the solder with less than about 1.0 weight % of a dopant selected from cadmium, indium and antimony. The doped eutectic solder exhibits increased resistance to thermally or mechanically induced cyclic stress and strain. As a result, the fatigue resistance of the solder joint is increased. Combination of dopants, such as indium and cadmium, in combined amounts of less than 0.5 weight % are especially effective in increasing the fatigue resistance of the lead-tin eutectic solder.
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