Thermal test jig of semiconductor optical device substrate

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal test jig of an optical device substrate required for thermal testing of an optical component assembled on an alumina substrate mounted in an optical transmission / reception module for use in an optical communication system. In the present invention, in order to solve the problem that it is very difficult to maintain uniform contact without short circuit between the contacts in the conventional method, in the present invention, a circuit is formed on a thin substrate having elasticity and an incision is formed at the contact part. By maintaining the contact evenly by allowing each contact to be contacted independently on the optical device substrate of the upper surface of the body is formed a mounting groove for mounting a plurality of optical device panels side by side and the rotation block and hinge in the center The groove for installing the shaft and the groove for installing the compression spring is formed, the rotation Conductive wires are etched on the bottom surface by fixing screws and fixing blocks on the upper surface of the block, and the ends are cut to allow independent contact with the optical device substrate.