SEMICONDUCTOR DEVICE TESTING BOARD, SEMICONDUCTOR DEVICE TESTING METHOD, CONTACT DEVICE AND TESTING METHOD USING THIS AND SEMICONDUCTOR DEVICE TESTING JIG

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a projecting electrode and testing efficiency. SOLUTION: In this testing board, by loading a semiconductor device 22 in a substrate body 23 and electrically connecting a wire bump 24 to a projecting electrode 27 in this loading condition, the semiconductor device 22 is tested. The wire bump 24 is formed in an electrode structure projecting in a vertical direction against the body 23 and with the semiconductor device 22 loaded in the body 23 and by using a testing board 20 constructed such that the wire bump 24 is inserted into the projecting electrode 27 provided in the semiconductor electrode 27, the semiconductor device 22 is tested.