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The present invention relates to a photo-curable silicone resin composition for a circuit board protective coating of a solventless printed circuit board and a method of protecting a mounting circuit board using the same
The present invention relates to a photo-curable silicone resin composition for a circuit board protective coating of a solventless printed circuit board and a method of protecting a mounting circuit board using the same
The present invention relates to (A) an organopolysiloxane having a hydroxyl group at both ends of a molecular chain represented by the following general formula (1);HO [(CH 3 ) 2 SiO] n H (1);(Wherein n is an integer of 1 to 200);(D) 2-ethylhexyl 2-methyldimethoxysilylpropanate, (E) a photopolymerization initiator, and (F) a moisture curing catalyst And a viscosity at 25 DEG C of 20 to 500 cP. The present invention also relates to a silicone resin composition for a protective circuit for a mounting circuit board.;It is possible to easily and reliably form a uniform coating film on the surface of the mounting circuit without diluting it with a solvent such as an organic solution or the like and also to manufacture a protective coating by curing the coating film, , And further protects the mounting circuit board from external environment.
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机译:本发明涉及(A)由下述通式(1)表示的分子链的两端具有羟基的有机聚硅氧烷; HO [(CH 3 Sub>) 2 Sub> SiO] n Sub> H(1);(其中n为1至200的整数);(D)2-甲基二甲氧基甲硅烷基丙酸酯2-乙基己基,(E)光聚合引发剂,和(F)湿气固化催化剂,在25℃下的粘度为20〜500cP。本发明还涉及用于安装电路板的保护电路的有机硅树脂组合物。可以容易且可靠地在安装电路的表面上形成均匀的涂膜,而无需用诸如有机溶剂的溶剂稀释它。溶液等,并通过使涂膜固化来制造保护涂层,并且进一步保护安装电路板免受外部环境的影响。
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