The present invention relates to a photo-curable silicone resin composition for a circuit board protective coating of a solventless printed circuit board and a method of protecting a mounting circuit board using the same

摘要

The present invention relates to (A) an organopolysiloxane having a hydroxyl group at both ends of a molecular chain represented by the following general formula (1);HO [(CH ₃ ) ₂ SiO] _n H (1);(Wherein n is an integer of 1 to 200);(D) 2-ethylhexyl 2-methyldimethoxysilylpropanate, (E) a photopolymerization initiator, and (F) a moisture curing catalyst And a viscosity at 25 DEG C of 20 to 500 cP. The present invention also relates to a silicone resin composition for a protective circuit for a mounting circuit board.;It is possible to easily and reliably form a uniform coating film on the surface of the mounting circuit without diluting it with a solvent such as an organic solution or the like and also to manufacture a protective coating by curing the coating film, , And further protects the mounting circuit board from external environment.