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PROCESS OF MANUFACTURE OF SEMICONDUCTOR DEVICES WITH SCHOTTKY BARRIER ON INDIUM PHOSPHIDE

机译:用磷化氢肖特基势垒制造半导体器件的过程

摘要

FIELD: semiconductor technology. SUBSTANCE: in compliance with invention chemical treatment of plates of indium phosphide is performed in concentrated hydrofluoric acid at temperature from 80 up to 160 C. Treatment lasts for not less than 5 min and leads to formation of adsorbed ions of fluoride on surface of semiconductor. Important feature of invention consists in deposition of metal after interval of less than 60 min after treatment. For this purpose plates of indium phosphide are heated to temperatures exceeding 120 C, fluoride volatilizes from surface and nonactive metal is sprayed. EFFECT: increased breakdown voltages thanks to growth of height of Schottky barrier. 1 tbl
机译:领域:半导体技术。物质:根据本发明,在浓氢氟酸中于80至160℃的温度下对磷化铟板进行化学处理。处理持续不少于5分钟,并导致在半导体表面上形成氟化物吸附离子。本发明的重要特征在于在处理后少于60分钟的间隔之后金属的沉积。为此目的,将磷化铟板加热至超过120℃的温度,氟化物从表面挥发,并喷洒非活性金属。效果:由于肖特基势垒高度的增加,击穿电压增加。 1汤匙

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