Pb-free Sn-Ag-Cu ternary eutectic solder

摘要

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag- about 1.7 weight % Cu having a eutectic melting temperature of about 217° C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid- solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15° C. above the eutectic melting temperature).