PURPOSE: A tin-silver-cerium ternary Pb-free soldering alloy composition is provided to reduce manufacturing costs by producing a tin-silver-cerium ternary Pb-free soldering alloy without using Cu.;CONSTITUTION: A tin-silver-cerium ternary Pb-free soldering alloy composition is composed of silver 0.3~1.4 weight%, cerium 0.001~2.0 weight%, and tin. The tin-silver-cerium ternary Pb-free soldering alloy composition is used for manufacturing a solder preform. The solder preform is one of solder paste, solder ball, solder bar, solder wire, solder bump, solder film, solder powder, solder pellet, solder granule, solder ribbon, solder washer, solder ring, and solder disk.;COPYRIGHT KIPO 2012
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