首页> 外国专利> Image sensor having a multi-layered printed circuit board with increased parallel-plate capacitance and method for manufacturing the same

Image sensor having a multi-layered printed circuit board with increased parallel-plate capacitance and method for manufacturing the same

机译:具有具有增加的平行板电容的多层印刷电路板的图像传感器及其制造方法

摘要

A multi-layered printed circuit board forms a base of a sensor board. Sensor chips are mounted on the multi-layered printed circuit board. The multi-layered printed circuit board is composed of a substrate, a first conductor layer, an internal insulator layer, a second conductor layer, and a surface insulator layer. An analog ground line is formed of the electrolytic copper foil of the first conductor layer by chemical etching. A signal line is formed of the electrolytic copper foil of the second conductor layer by chemical etching. Insulator layers are formed between the first conductor layer and the second conductor layer to generate a distributed capacitance between the signal line and the analog ground line for filtering out noise and improving performance.
机译:多层印刷电路板构成传感器板的基础。传感器芯片安装在多层印刷电路板上。多层印刷电路板由基板,第一导体层,内部绝缘体层,第二导体层和表面绝缘体层组成。模拟接地线通过化学蚀刻由第一导体层的电解铜箔形成。信号线通过化学蚀刻由第二导体层的电解铜箔形成。绝缘体层形成在第一导体层和第二导体层之间,以在信号线和模拟地线之间产生分布电容,以滤除噪声并改善性能。

著录项

  • 公开/公告号US5569390A

    专利类型

  • 公开/公告日1996-10-29

    原文格式PDF

  • 申请/专利权人 MITSUBISHI DENKI KABUSHIKI KAISHA;

    申请/专利号US19950457319

  • 发明设计人 TAKAFUMI ENDO;

    申请日1995-06-01

  • 分类号B44C1/22;C23F1/00;

  • 国家 US

  • 入库时间 2022-08-22 03:37:42

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