COPPER ALLOY, EXCELLENT IN ADHESION OF SOFT SOLDER AND PLATING SUITABILITY AND EASY OF CLEANING, AND ITS PRODUCTION

摘要

PURPOSE: To improve the acid pickling property of a Cu-Ni-Si alloy, as its disadvantage, while making the most of the characteristics of high strength and high electric conductivity as its advantages. ;CONSTITUTION: This copper alloy has a composition consisting of, by weight, 0.4-4.0% Ni, 0.1-1.0% Si, 1.0-2.0% Zn, 0.0001-0.01% Cr, 0.0001-0.001% Mg, and the balance essentially copper with inevitable impurities and containing, if necessary, 0.01-0.1% Mn and 0.0001-0.01% Al. Further, the grain size of Ni₂Si as precipitate is regulated to ≤10nm and also the content of S as inevitable impurity is regulated to ≤10ppm. By this method, the copper alloy, excellent in adhesion of soft solder and plating suitability and easy of cleaning, can be produced.;COPYRIGHT: (C)1996,JPO