Laser processing method and manufacturing method of a multilayer ceramic electronic component of green sheet for ceramic electronic components

摘要

PURPOSE: To provide the title electronic component whose characteristic has been enhanced further by a method wherein a desired part on a green sheet is irradiated with a laser beam, a recessed part is formed, a conductive layer is formed in the recessed part and a plurality of green sheets in this constitution are laminated and compression-bonded. ;CONSTITUTION: A desired part on a green sheet 21 which is composed mainly of an Ni-Zn-based ferrite powder is irradiated with a laser beam to form a recessed part 22 and further a deep through hole 23. Ths operation is repeated, and a plurality of patterns are formed on the green sheet 21. Then, a conductive layer 31 by an Ag conductive paste is screen-printed on the green sheet 21 in which the recessed part 22 has been formed, the conductive paste is printed so as to fill also the through hole 23. then, a laminated body in which a plurality of green sheets in this constitution have been laminated is compression-bonded, the laminated body is cut to a chip size for a desired electronic component, a cut laminated body is fired, and a chip-shaped laminated body is obtained.;COPYRIGHT: (C)1995,JPO