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The solder belt entering flux sheet and the production manner, and uses this solder belt entering flux sheet the soldered manner

机译:助焊剂进入助焊剂片的生产方式,并使用该钎焊剂进入助焊剂片的焊接方式

摘要

PURPOSE:To uniformize soldering quality by filling flux between plural parallel solder wires and subsequently, sticking pieces of released paper thereto to form a flux sheet and soldering electronic parts via the flux sheet. CONSTITUTION:The plural solder wires 1 are arranged in parallel on the bottom of a vessel 3 and the flux 7 is filled and solidified on the vessel bottom 4 and further, the pieces of released paper, 8 are stuck to the surfaces to form the flux sheet 2. One surface of the flux sheet 2a containing the solder wires whose peeling paper 8 is removed is then arranged corresponding to lead wires of the electronic parts. The other surface is adhered on a printed board and the flux sheet 2a is heated to perform soldering. Since the solder wires arranged in parallel at prescribed intervals are arranged corresponding to the lead wires 13 to perform soldering, excess and deficiency of the solder quantity and the occurrence of bridge are prevented. Accordingly, the soldering quality is uniformized.
机译:目的:通过在多条平行焊锡线之间填充助焊剂,然后在其上粘贴脱模纸片以形成助焊剂板,并通过助焊剂板焊接电子零件,以使焊接质量均匀。组成:多条焊锡线1平行排列在容器3的底部,助焊剂7填充并固化在容器底部4上,此外,释放的纸片8粘附在表面上形成助焊剂然后,将助焊剂片2a的包含焊料线的一个表面布置成与电子部件的引线相对应,该焊料线的表面被去除了去皮纸8。另一表面粘附在印刷板上,并且加热焊剂片2a以执行焊接。由于以预定间隔平行布置的焊丝对应于引线13布置以进行焊接,所以防止了焊料量的过多和不足以及桥接的发生。因此,焊接质量均匀。

著录项

  • 公开/公告号JP2573289B2

    专利类型

  • 公开/公告日1997-01-22

    原文格式PDF

  • 申请/专利权人 TOKYO SHIBAURA ELECTRIC CO;

    申请/专利号JP19880070090

  • 发明设计人 SHIMA TOSHIHIRO;

    申请日1988-03-24

  • 分类号B23K35/14;B23K35/40;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-22 03:29:25

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