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The copper ware null which early verdigris coat forms

机译:早期铜绿涂层形成的铜器无效

摘要

PURPOSE:To produce a copper product forming a homogeneous patina film on the whole surface in an early stage by allowing a potentially noble substance nobler than copper or copper alloy to adhere to the surface of a copper product consisting of copper or copper alloy by means of displacement plating, electroplating, etc. CONSTITUTION:A potentially noble substance nobler than copper or copper alloy is allowed to adhere to the surface of a copper product in which at least the surface is composed of copper or copper alloy. As the above potentially noble substance, one or more elements among Ag, Au, C, and platinum group elements are preferred. Further, it is preferable to regulate coating weight to 1-1000mg/m2. As a method for the adhesion of the above substances, displacement plating using plating waste liquor, electroplating, application in a pasted state, application in the state of a mixture prepared by being mixed in the form of granular body into resin, etc., can be used. By this method, local cells in which the above substances act as cathodes and the above copper or copper alloy acts as anode at the product surface can be formed, and patina can be formed with increasing speed.
机译:目的:通过使比铜或铜合金更贵重的潜在贵重物质通过以下方式附着在由铜或铜合金组成的铜产品的表面上,从而在早期阶段在整个表面上形成均匀的铜绿膜的铜产品:组成:比铜或铜合金贵重的潜在贵重物质被允许粘附到至少由铜或铜合金组成的铜产品表面。作为上述潜在的贵金属,优选Ag,Au,C和铂族元素中的一种或多种元素。此外,优选将涂层重量调节为1-1000mg / m 2。作为上述物质的附着方法,可以使用电镀废液进行置换电镀,电镀,以糊状涂布,以颗粒状混入树脂而制成的混合物状态下涂布等。使用。通过这种方法,可以形成在产品表面上上述物质充当阴极并且上述铜或铜合金充当阳极的局部电池,并且可以以更高的速度形成铜绿。

著录项

  • 公开/公告号JP2599454B2

    专利类型

  • 公开/公告日1997-04-09

    原文格式PDF

  • 申请/专利权人 古河電気工業株式会社;

    申请/专利号JP19890024580

  • 发明设计人 松田 晃;柴田 宣行;

    申请日1989-02-02

  • 分类号C23C30/00;

  • 国家 JP

  • 入库时间 2022-08-22 03:28:14

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