BARE CHIP MOUNTED BOARD, METHOD OF MANUFACTURING THE BOARD, AND METHOD OF FORMING ELECTRODE OF BARE CHIP

摘要

A bare chip mounted board on which electronic parts can be mounted at a high density. A bare chip (2) is mounted on a glass substrate (1) and various kinds of thin film electronic elements are formed on the substrate (1). The thin film electronic elements shown in the figure are TFT (3), a diode (4), a capacitor (5), and a resistor (6), all being covered with a protective film (7). The electronic elements are formed by lithography. A wiring layer is also formed by lithography. The bare chip (2) does not have any pad for electrode and electrode terminals are led out from the wiring layer on the lower surface of the chip (2) and directly connected to the connecting terminals of the substrate (1) through A1 wiring (8). When the glass substrate (1) is used as a printed wiring board in such a way, thin film electronic elements can be formed at a high density by lithography.