Bare chip mounting board, manufacturing method of bare chip mounting board, and electrode forming method of bare chip

摘要

It is a bare chip mounting board capable of forming electronic parts at high density. Various thin film electronic elements are formed on the glass substrate (1) and bare chips (2) are mounted. The thin film electronic device shown in the figure is a TFT (3), a diode (4), a capacitor (5), and a resistor (6). The thin film electronic device is covered with a protective film (7). These are formed by lithography. Similarly, a wiring layer is formed by lithography. The bare chip (2) has no electrode pad, and the electrode terminal is taken out from the wiring layer on the lower surface of the chip. The electrode terminals are directly connected to the connection terminals of the glass substrate 1 by Al wiring (8). Thus, using a glass substrate (1) as a printed wiring board, it is possible to form a high-density thin film electronic device by lithography.