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Residual detection method of die-bonding adhesive in die-bonding adhesive injector

机译:芯片粘接胶粘剂注射器中芯片粘接胶的残留检测方法

摘要

A charge transmitter sensor installed at a predetermined position of the die bonding adhesive injector detects the amount of charge accumulated in a predetermined space in the die bonding adhesive injector, and a difference in the amount of charge more than the predetermined predetermined amount occurs between the detected charge amount and the predetermined charge amount. In this case, the electrical signal is output through the output terminal of the accumulated charge measurement device, and the alarm device is activated to determine the correct replacement time of the die-bonding adhesive injector, thereby saving the bonding bond and preventing the occurrence of a defective package.
机译:安装在芯片键合注入器的预定位置处的电荷传送器传感器检测在芯片键合注入器中的预定空间中累积的电荷量,并且在检测到的电荷之间存在大于预定预定量的电荷差。充电量和预定充电量。在这种情况下,通过累积电荷测量装置的输出端子输出电信号,并激活警报装置以确定芯片键合胶粘剂注射器的正确更换时间,从而节省键合胶合并防止发生有缺陷的包装。

著录项

  • 公开/公告号KR970018276A

    专利类型

  • 公开/公告日1997-04-30

    原文格式PDF

  • 申请/专利权人 김광호;

    申请/专利号KR19950033400

  • 发明设计人 전종근;이화영;

    申请日1995-09-30

  • 分类号H01L21/52;

  • 国家 KR

  • 入库时间 2022-08-22 03:17:51

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