Surface mount package with external leads with stress distribution penetrations to prevent solder cracking

摘要

The present invention relates to a surface-mount package, in order to compensate for the disadvantage that occurs in the front end of the outer lead of the package to reduce the mechanical strength of the outer lead to form a through portion in the predetermined portion of the outer lead, the through portion stress By eliminating the loss of strength in terms of concentration, and eliminating the tin plating process by soldering by inserting solder into the penetrating portion, a low cost and high reliability package can be realized.