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A method for the production of eeprom - memory cells with a single polysilicon layer and a thin oxide by means of different oxidation

机译:一种通过不同的氧化方法生产具有单层多晶硅层和薄氧化物的eeprom存储单元的方法

摘要

Method,It is used to manufacture EEPROM storage units,It, which has, selects transistor(20)Polysilicon and thin oxide film a single level,Sensing has a floating gate(5)Transistor(22),Control door(10),It is with capacitive coupling,It is with thin oxide film(9)Floating gate(5)With a tunnel area(23),Including being related to effective coverage(The first step of 41 definition(29),42)Without field oxidation(11),In control door(10)And floating gate(5)Between in a coupled zone(24)It is related to the implantation of ion(10 minutes)A second step(30),One third step(31),It is related in effective coverage(41 gate oxide(21)Creation,42),It is related to the implantation of additional ion(10 seconds one the 4th steps(32),8)In the attachment areas(24)In control door(10)And floating gate(5)Between and in the tunnel area(23),One the 5th step(33),It is related in the region(Gate oxide on 24(21)At the removal of stratum,23),It is related to coupled oxide(12)Difference increase and tunnel oxide(9)The 6th step(34),It is in the attachment areas(24)And tunnel area(23)With one the 7th step(35),It is related to the polysilicon for forming floating gate(5)The deposition of layer.
机译:方法,用于制造EEPROM存储单元,具有选择单级晶体管(20)多晶硅和氧化膜,传感具有浮栅(5)晶体管(22),控制门(10),它带有电容耦合,带有氧化膜(9),浮动栅(5),具有隧道区(23),包括与有效覆盖率有关的(41定义的第一步(29),42)没有场氧化( 11),在控制门(10)和浮动门(5)之间的耦合区域(24)与离子注入(10分钟)有关第二步(30),第三步(31),与有效覆盖有关(41栅极氧化物(21)生成,42),与附加离子的注入(第四步10秒之一(32),8)在附着区域(24)在控制门中( 10)与浮动栅(5)之间和隧道区域之间(23),第五步(33)之一,与该区域相关(24层栅氧化层(21),去除地层,23),与耦合氧化物(12)差异增加和隧道氧化物(9)有关6第三步(34),在附接区(24)和隧道区(23)中,与第七步(35)之一,涉及用于形成浮栅的多晶硅(5)的沉积层。

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