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A method for the preparation of a diaphragm for reduction of particles in a chamber for the physical vapor deposition

机译:一种制备用于减少物理气相沉积室中的颗粒的隔膜的方法

摘要

In a method for preparing a shield and/or clamping ring prior to use in a physical vapor deposition process, the shield and/or clamping ring is first bead blasted using an abrasive powder, then is treated in an ultrasonic cleaning chamber to remove loose particles and then sputter etched or treated with a plasma. The sputtering or plasma treatment serves to loosen contamination which may form a diffusion barrier and prevent the deposits from bonding to the shield and also serves to roughen the surface of the shield and/or clamping ring, to reduce interface voids and improve adhesion of sputtered material onto the shield and/or clamping ring. The process of the invention results in improved cleaning of the shield and/or clamping ring and improved adhesion of sputtered material thereon, thereby increasing the time before the shield/clamping ring must be cleaned and reducing down-time of the physical vapor deposition chamber.
机译:在用于在物理气相沉积过程中使用之前制备屏蔽和/或夹紧环的方法中,首先使用磨料粉对屏蔽和/或夹紧环进行喷砂处理,然后在超声清洗室中对其进行处理,以除去松散的颗粒。然后溅射蚀刻或用等离子体处理。溅射或等离子处理可消除可能形成扩散障碍并防止沉积物粘结到屏蔽层的污染物,还可以使屏蔽层和/或夹紧环的表面变粗糙,以减少界面空隙并改善溅射材料的附着力到屏蔽和/或夹紧环上。本发明的方法导致改善了对屏蔽和/或夹紧环的清洁并改善了溅射材料在其上的附着力,从而增加了必须清洁屏蔽/夹紧环之前的时间,并减少了物理气相沉积室的停机时间。

著录项

  • 公开/公告号DE69305291T2

    专利类型

  • 公开/公告日1997-05-28

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC US;

    申请/专利号DE1993605291T

  • 发明设计人 MINTZ DONALD M US;

    申请日1993-06-22

  • 分类号C23C14/00;B08B7/04;C23C14/56;C23C16/44;C23C14/02;

  • 国家 DE

  • 入库时间 2022-08-22 03:12:55

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