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Polysilicon gate reoxidation in a gas mixture of oxygen and nitrogen trifluoride gas by rapid thermal processing to improve hot carrier immunity
Polysilicon gate reoxidation in a gas mixture of oxygen and nitrogen trifluoride gas by rapid thermal processing to improve hot carrier immunity
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机译:通过快速热处理在氧气和三氟化氮气体混合物中进行多晶硅栅极再氧化,以提高热载流子抗扰度
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摘要
A method of forming an FET transistor comprises forming a stack of a gate oxide layer and a control gate electrode on a surface of a doped semiconductor substrate with counterdoped source/drain regions therein. A silicon oxide layer is formed over the stack of the gate oxide layer and the control gate electrode and exposed portions of the semiconductor substrate including the source/drain regions. Then the silicon oxide layer and the corners of the gate oxide layer are fluorinated by rapid thermal processing providing a fluorinated silicon oxide layer. The rapid thermal processing is performed in an atmosphere of NF.sub.3 gas and O. sub.2 gas at a temperature from about 900° C. to about 1050° C. for a time duration from about 10 seconds to about 50 seconds, and the fluorinated silicon oxide layer has a thickness from about 200 Å to about 400 Å.
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