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CONDUCTIVE SILICONE COMPOSITION TO BE CURED BY ADDITION REACTION AND PRODUCTION OF CONDUCTIVE CURED PRODUCT

机译:通过加成反应和生产导电性固化产物可制得的导电硅酮成分

摘要

PROBLEM TO BE SOLVED: To produce a conductive silicone composition, to be cured by an addition reaction, which can cure through an addition reaction and form a conductive silicone cured product having low electrical resistance and low electric receptivity and small in the temperature dependence of electrical resistance and a change of electrical resistance and electric resistivity with time, and to efficiently produce such a conductive silicone cured product. SOLUTION: This conductive silicone composition to be cured by an addition reaction comprises (A) 100 pts.wt. of an organopolysiloxane having, in a molecule, at least two alkenyl groups, (B) a composition-sufficietly curing quantity of an organopolysiloxane having, in a molecule, at least two hydrogens combined with a silicon, (C) 50-2000 pts.wt. of conductive metal-based finely divided powder, (D) a catalytic quantity of platinum-based catalyst for addition reaction and (E) 0.1-10 pts.wt., based on 100 pts.wt. of the total of components A, B, C and D, of a volatile solvent with a higher boiling pint (=400 deg.C) than the setting temperature of the composition. This conductive silicone cured product is obtained by removing the component E during or after curing this composition.
机译:解决的问题:生产通过加成反应固化的导电性有机硅组合物,该导电性有机硅组合物可以通过加成反应进行固化,形成导电性低,电阻率低,电接受度低的导电性有机硅固化物。电阻以及电阻和电阻率随时间的变化,以有效地生产这种导电性有机硅固化产物。解决方案:这种可通过加成反应固化的导电有机硅组合物占(A)100pts.wt。在分子中具有至少两个烯基的有机聚硅氧烷的组成(B):在分子中具有至少两个与硅结合的氢的有机聚硅氧烷的组成足以固化量的(C)50-2000 pts。重量导电金属基细粉,(D)催化量的铂基催化剂用于加成反应,和(E)0.1-10 pts.wt.,基于100pts.wt。沸点(<= 400℃)比组合物的凝固温度高的挥发性溶剂的组分A,B,C和D的总和。该导电硅氧烷固化产物是通过在固化该组合物期间或之后除去组分E而获得的。

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